1554116-3

説明 :
CONN SOCKET LGA 1356POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30μin (0.76μm)
Contact Finish Thickness - Post :
30μin (0.76μm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Thermoplastic
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
1356 (32 x 41)
Operating Temperature :
-25°C ~ 100°C
Packaging :
Tray
Pitch - Mating :
0.040" (1.02mm)
Pitch - Post :
0.040" (1.01mm)
Series :
-
Termination :
Solder
Type :
LGA
倍数 :
1

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