IC用ソケット、トランジスタ - Zui Ai Technology（Taiwan）Company.

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Housing Material：

Number of Positions or Pins (Grid)：

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

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画像	品番	メーカー	数量	配達期間	単価	買う	説明	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
画像	品番	メーカー	数量	配達期間	単価	買う	説明	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	A 08-LC-TT	ASSMANN WSW Components	108,884	3日	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	A 14-LC-TT	ASSMANN WSW Components	81,814	3日	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	A 16-LC-TT	ASSMANN WSW Components	48,059	3日	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	A 18-LC-TT	ASSMANN WSW Components	36,980	3日	-	CONN IC DIP SOCKET 18POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	A 20-LC-TT	ASSMANN WSW Components	45,190	3日	-	CONN IC DIP SOCKET 20POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS TIN	Tube	-	-55°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	0.100" (2.54mm)	Tin	-	Phosphor Bronze
	ED281DT	On Shore Technology Inc.	28,344	3日	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	Tube	ED	-55°C ~ 110°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polybutylene Terephthalate (PBT)，Glass Filled	28 (2 x 14)	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	60μin (1.52μm)	Phosphor Bronze
	4808-3004-CP	3M	13,906	3日	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	8 (2 x 4)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze
	4816-3000-CP	3M	8,449	3日	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	16 (2 x 8)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze
	AR 08 HZL-TT	ASSMANN WSW Components	47,594	3日	-	CONN IC DIP SOCKET 8POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	SA143000	On Shore Technology Inc.	2,645	3日	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	SA	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester，Glass Filled	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass
	4828-3004-CP	3M	19,400	3日	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	Tube	4800	-25°C ~ 85°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polyester，Glass Filled	28 (2 x 14)	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	35μin (0.90μm)	Phosphor Bronze
	110-43-308-41-001000	Mill-Max Manufacturing Corp.	28,542	3日	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	8 (2 x 4)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	A-CCS 044-Z-SM	ASSMANN WSW Components	24,224	3日	-	IC SOCKET PLCC 44POS TIN SMD MOQ: 1 MPQ: 1	IC SOCKET PLCC 44POS TIN SMD	Tube	-	-40°C ~ 105°C	Surface Mount	PLCC	Closed Frame	Solder	Polyamide (PA9T)，Nylon 9T，Glass Filled	44 (4 x 11)	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze
	SA143040	On Shore Technology Inc.	7,780	3日	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	SA	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester，Glass Filled	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Gold	80μin (2.03μm)	Brass
	110-43-306-41-001000	Mill-Max Manufacturing Corp.	8,743	3日	-	CONN IC DIP SOCKET 6POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 6POS GOLD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	6 (2 x 3)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	SA163000	On Shore Technology Inc.	6,028	3日	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	Tube	SA	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester，Glass Filled	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass
	AR 14 HZL-TT	ASSMANN WSW Components	8,465	3日	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	AR 16 HZL-TT	ASSMANN WSW Components	16,495	3日	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Thermoplastic，Polyester	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	A-CCS-044-Z-T	ASSMANN WSW Components	21,261	3日	-	CONN SOCKET PLCC 44POS TIN MOQ: 1 MPQ: 1	CONN SOCKET PLCC 44POS TIN	Tube	-	-40°C ~ 105°C	Through Hole	PLCC	Closed Frame	Solder	Polybutylene Terephthalate (PBT)	44 (4 x 11)	0.050" (1.27mm)	Tin	160μin (4.06μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	160μin (4.06μm)	Phosphor Bronze
	115-43-308-41-003000	Mill-Max Manufacturing Corp.	3,743	3日	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Tube	115	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	8 (2 x 4)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy

正常に送信されました。