- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 10μin (0.25μm)
- Contact Finish Thickness - Post :
- 10μin (0.25μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- FR4 Epoxy Glass
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 480 (29 x 29)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Bulk
- Pitch - Mating :
- 0.050" (1.27mm)
- Pitch - Post :
- 0.050" (1.27mm)
- Series :
- 558
- Termination :
- Solder
- Type :
- PGA
- 倍数 :
- 1