550-10-056-09-041101

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

10μin (0.25μm)

Contact Finish Thickness - Post :

10μin (0.25μm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

56 (9 x 9)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Bulk

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

550

Termination :

Solder

Type :

PGA

倍数 :

1