214-44-632-01-670800

説明 :
CONN IC DIP SOCKET 32POS TIN
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
100μin (2.54μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass Alloy
Features :
Closed Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Polyester
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
214
Termination :
Solder
Type :
DIP,0.6" (15.24mm) Row Spacing
倍数 :
1

同様の商品