D2899-42

説明 :
CONN IC DIP SOCKET 99POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
197μin (5.00μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
Polyamide (PA),Nylon,Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
99 (1 x 99)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.200" (5.08mm)
Pitch - Post :
0.200" (5.08mm)
Series :
D2
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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