画像はあくまで参考です
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 20μin (0.51μm)
- Contact Finish Thickness - Post :
- 20μin (0.51μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS)，Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 44 (2 x 22)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Pitch - Mating :
- -
- Pitch - Post :
- 0.050" (1.27mm)
- Series :
- 547
- Termination :
- Solder
- Type :
- SOIC，ZIF (ZIP)
- 倍数 :
- 1
