32-3575-11

説明 :
CONN IC DIP SOCKET ZIF 32POS
Contact Finish - Mating :
Nickel Boron
Contact Finish - Post :
Nickel Boron
Contact Finish Thickness - Mating :
50μin (1.27μm)
Contact Finish Thickness - Post :
50μin (1.27μm)
Contact Material - Mating :
Beryllium Nickel
Contact Material - Post :
Beryllium Nickel
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
57
Termination :
Solder
Type :
DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing
倍数 :
1

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