28-823-90C
- 説明 :
- CONN IC DIP SOCKET 28POS GOLD
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 30μin (0.76μm)
- Contact Finish Thickness - Post :
- 200μin (5.08μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- Polyamide (PA46),Nylon 4/6,Glass Filled
- Mounting Type :
- Through Hole,Right Angle,Horizontal
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- Vertisockets 800
- Termination :
- Solder
- Type :
- DIP,0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
正常に送信されました。
1営業日以内にあなたの情報に返信します。