BGS13SL9E6327XTSA1

Circuit :

SP3T

Features :

-

Frequency - Lower :

100MHz

Frequency - Upper :

3GHz

IIP3 :

-

Impedance :

50 Ohm

Insertion Loss @ Frequency :

0.54dB @ 2.7GHz

Isolation @ Frequency :

22dB @ 2.7GHz (typ)

Operating Temperature :

-30°C ~ 85°C

P1dB :

-

Package / Case :

6-XFLGA

Packaging :

Cut Tape (CT)

RF Type :

Bluetooth，WLAN

Series :

-

Supplier Device Package :

TSLP-9-3

Topology :

Reflective

Voltage - Supply :

2.4 V ~ 3.6 V