ASSMANN WSW Components

V-1102-SMD/A-L

説明 :
HEATSINK TO-263 19.38X25.40MM
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.450" (11.43mm)
Length :
0.763" (19.38mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-263 (D2Pak)
Power Dissipation @ Temperature Rise :
-
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
23.00°C/W
Type :
Top Mount
Width :
1.000" (25.40mm)

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