- Attachment Method :
- SMD Pad
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.400" (10.16mm)
- Length :
- 0.500" (12.70mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D2Pak)
- Power Dissipation @ Temperature Rise :
- 1.3W @ 30°C
- Series :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 10.00°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 18.00°C/W
- Type :
- Top Mount
- Width :
- 1.030" (26.16mm)