- Packaging：
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- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- SATA：
-
- USB：
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- Security Features：
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43個の商品を探す
 |
画像 | 品番 | メーカー | 数量 | 配達期間 | 単価 | 買う | 説明 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
画像 | 品番 | メーカー | 数量 | 配達期間 | 単価 | 買う | 説明 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
|
|
|
NXP USA Inc. |
1,917
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
442
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
420
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
450
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
161
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
147
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
450
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
800
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 527-LFBGA | 527-BGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
450
|
3日 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
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NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | EPDC，LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | EPDC，LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | EPDC，LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | EPDC，LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
お問い合わせ
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG |
