Utilized IC / Part:
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145個の商品を探す
画像 品番 メーカー 数量 配達期間 単価 買う 説明 Series Interface Voltage - Supply Sensitivity Embedded Utilized IC / Part Supplied Contents Sensor Type Sensing Range
FRDM-STBC-AGM01
NXP USA Inc.
27
3日
-
MOQ: 1  MPQ: 1
FREEDOM BOARD FXAS21002/FXOS8700
- - - - - FXAS21002,FXOS8700 Board(s) Accelerometer,Gyroscope,Magnetometer -
RD-KL25-AGMP01
NXP USA Inc.
22
3日
-
MOQ: 1  MPQ: 1
DATA COLLECTION REFERENCE DESIGN
- - - - Yes,MCU,32-Bit BC3770,FXAS21002,FXOS8700CQ,K20,KL25Z,MPL3115A2 Board(s),Cable(s) Accelerometer,Gyroscope,Electronic Compass,Pressure,Temperature -
FRDM-K64F-AGM01
NXP USA Inc.
32
3日
-
MOQ: 1  MPQ: 1
EVB KIT FRDM-K64F/FRDM-STBCAGM01
Kinetis - - - Yes,MCU,32-Bit K24,K63,K64,FXAS21002,FXOS8700,mbed-Enabled Development Board(s) Accelerometer,Gyroscope,Magnetometer -
FRDM-FXS-MULT2-B
NXP USA Inc.
8
3日
-
MOQ: 1  MPQ: 1
BLUETOOTH DEV PLATFORM
Freedom Xtrinsic RF - - - FXAS21002C,FXLS8471Q,FXOS8700CQ,MAG3110,MMA9553L,MMA8652FC,MPL3115A2 Board(s) Accelerometer,Gyroscope,Magnetometer,Pressure -
FRDM-K22F-AGM01
NXP USA Inc.
7
3日
-
MOQ: 1  MPQ: 1
EVB KIT FRDM-K22F/FRDM-STBCAGM01
Kinetis - - - Yes,MCU,32-Bit K22,FXAS21002,FXOS8700,mbed-Enabled Development Board(s) Accelerometer,Gyroscope,Magnetometer -
LFSTBEB865X
NXP USA Inc.
5
3日
-
MOQ: 1  MPQ: 1
BOARD EVAL FOR MMA865XFC
- I2C 1.95 V ~ 3.6 V 1024 count/g,512 count/g,256 count/g,128 count/g,64 count/g - MMA8652FC,MMA8653FC Board(s) Accelerometer,3 Axis ±2g,4g,8g
EVBCRTOUCH
NXP USA Inc.
4
3日
-
MOQ: 1  MPQ: 1
BOARD EVAL TOUCH SENSING PLTFRM
- - - - - CRTOUCH Board(s),Cable(s),Accessories Touch Screen -
LFSTBEB8491
NXP USA Inc.
2
3日
-
MOQ: 1  MPQ: 1
BOARD EVAL FOR MMA8491Q
- I2C 1.95 V ~ 3.6 V 1024 count/g No MMA8491Q Board(s) Accelerometer,3 Axis ±8G
BRKT-STBC-AGM04
NXP USA Inc.
7
3日
-
MOQ: 1  MPQ: 1
FRDM BOARD FORMMA8652/ MAG3110
- - - - - - - - -
BRKTSTBC-A8491
NXP USA Inc.
12
3日
-
MOQ: 1  MPQ: 1
BREAKOUT BOARD FOR MMA8491Q
- Digital 1.95 V ~ 3.6 V 1024 count/g - MMA8491Q Board(s) Accelerometer,3 Axis ±8G
BRKTSTBC-P3115
NXP USA Inc.
8
3日
-
MOQ: 1  MPQ: 1
BREAKOUT BOARD FOR MPL3115A2
- I2C 1.95 V ~ 3.6 V - - MPL3115A2 Board(s) Pressure 20 ~ 110 kPa
FRDMSTBC-A8471
NXP USA Inc.
12
3日
-
MOQ: 1  MPQ: 1
EVAL BOARD FOR FXLS8471Q
- I2C,Serial,SPI 1.95 V ~ 3.6 V 4096 count/g,2048 count/g,1024 count/g - FXLS8471Q Board(s) Accelerometer,3 Axis ±2g,4g,8g
FRDMSTBC-P3115
NXP USA Inc.
11
3日
-
MOQ: 1  MPQ: 1
EVAL BOARD FOR MPL3115A2
- I2C 1.95 V ~ 3.6 V - - MPL3115A2 Board(s) Pressure 20 ~ 110 kPa
FRDMKL25-A8491
NXP USA Inc.
14
3日
-
MOQ: 1  MPQ: 1
MMA8491Q BOARD WITH FRDM-KL25Z
- Digital 1.95 V ~ 3.6 V 1024 count/g Yes,MCU,32-Bit KL1x,KL2x,MMA8491Q,mbed-Enabled Development Board(s),Cable(s) Accelerometer,3 Axis ±8G
FRDMKL25-P3115
NXP USA Inc.
11
3日
-
MOQ: 1  MPQ: 1
MPL3115A2 BOARD WITH FRDM-KL25Z
- I2C 1.95 V ~ 3.6 V - Yes,MCU,32-Bit KL1x,KL2x,MPL3115A2,mbed-Enabled Development Board(s),Cable(s) Pressure 20 ~ 110 kPa
FRDMKL25-A8471
NXP USA Inc.
10
3日
-
MOQ: 1  MPQ: 1
FXLS8471Q BOARD WITH FRDM-KL25Z
- I2C,Serial,SPI 1.95 V ~ 3.6 V 4096 count/g,2048 count/g,1024 count/g Yes,MCU,32-Bit FXLS8471Q,KL1x,KL2x,mbed-Enabled Development Board(s),Cable(s) Accelerometer,3 Axis ±2g,4g,8g
OM11055,598
NXP USA Inc.
25
3日
-
MOQ: 1  MPQ: 1
EVAL BOARD FOR PCF8883
- Mini USB 3 V ~ 9 V - No PCF8883 Board(s),Cable(s) Capacitive -
FRDM-STBC-SA9500
NXP USA Inc.
11
3日
-
MOQ: 1  MPQ: 1
EVAL BOARD FOR FXLC95000CL
- I2C,SPI 1.71 V ~ 1.89 V 0.061mg/LSB,0.122mg/LSB,0.244mg/LSB Yes,MCU,32-Bit FXLC95000CL Board(s) Accelerometer,3 Axis ±2g,4g,8g
FRDMSTBC-A8491
NXP USA Inc.
11
3日
-
MOQ: 1  MPQ: 1
EVAL BOARD FOR MMA8491Q
- Digital 1.95 V ~ 3.6 V 1024 count/g - MMA8491Q Board(s) Accelerometer,3 Axis ±8G
FRDM-K22F-SA9500
NXP USA Inc.
8
3日
-
MOQ: 1  MPQ: 1
FXLC95000CL BOARD WITH FRDM-K22F
- I2C,SPI 1.71 V ~ 1.89 V 0.061mg/LSB,0.122mg/LSB,0.244mg/LSB Yes,MCU,32-Bit FXLC95000CL,K22,mbed-Enabled Development Board(s),Cable(s) Accelerometer,3 Axis ±2g,4g,8g